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Fives Lund shared a development partnership with a pair of semiconductor companies for over 20 years. During this time, Lund contributed to the development of several key process technologies for semiconductor wafer processing.
These include:
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Electroplating
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Backside Film Etch
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Copper Backside Etch and Bevel Etch
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Supercritical 5000 psi CO2 Processing (300mm Wafer)
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Container Dry and Clean
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Wafer Clean (Single and Multi-Wafer)
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Thermal Processing Furnaces
Semiconductor Processing
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